About
Dr. Shi received the B.S. degree in Physics from Peking University 
, Beijing, China, in 2015, and the M.S. and Ph.D. degrees in Electrical Engineering from University of California, Los Angeles 
, in 2017 and 2020, respectively.
He was advised by Dr. Asad A. Abidi at UCLA.
He has been with the Wireless Connectivity Group, Broadcom Inc., San Jose, CA, USA, since 2020.
His research interests include RF/microwave and analog integrated circuit design.
Dr. Shi was a co-recipient of the 2022 IEEE JSSC Best Paper Award.
He was a recipient of the IEEE TCAS-I Editor-in-Chief’s Top Pick for the May 2023 Issue.
He was a nominee for the Best Student Paper Award at the 2021 IEEE RFIC Symposium.
He was a recipient of the Broadcom Foundation Fellowship in 2018.
He was the Gold Medal Winner of the Chinese Physics Olympiad and a Finalist of the National Physics Team in 2010.
He serves as a TPC member at the IEEE Cuctom Integrated Circuits Conference.
Contact Information
E-mail: 
News
[2025.07] Became an invited IEEE CICC TPC member.
[2024.02] Our JSSC paper is awarded 2022 IEEE JSSC Best Paper Award.
[2023.05] Our TCAS-I paper is select as “Highlight for the May 2023”.
[2023.02] One paper is accepted at TCAS-I.
[2022.09] One paper is accepted at JSSC.
[2021.12] One paper is accepted at JSSC.
[2021.10] One paper is accepted at ISSCC 2022.
[2021.07] Our RFIC paper is invited for JSSC special issue.